wire bonding memory substrate with gold plating manufacture

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HongRuiXing (Hubei) Electronics Co.,Ltd.

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wire bonding memory substrate with gold plating manufacture

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wire bonding memory substrate with gold plating manufacture

Application:IC package,Semiconductor package,Memory electronics,NAND/Flash memory; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:0.18mm; Material brand:Mainly ...

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UL Flexible Printed Circuit Board

Multilayer Flexible Printed Circuit Board

UL Smooth Printed Circuit Board

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